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DIGITAL-CASSINI

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High Speed Digital Devices

High Speed Digital, SOC, Wireless SOC, RF SOC

Cassini Modular ATE for High Speed Digital Devices
Cassini 16A Complete High Speed Automated
and Integrated Test Solution for:
  • Testing for Wafer, Package and Module formats
  • Protocol Based Engine for DUT Control
  • 120 Pins per TIM
    (Up to 10 TIMs per tester)
  • Pattern Import Tools
  • Logic Analysis Tools
  • Native JTAG Support
  • Pattern Generation on the Fly
Recommended Tester Instrument Modules (TIMs) for Digital Testing
Multiple TIMs can be configured per tester for maximum flexibility, like upgrading to multi-site testing. One Device Power module per site.

Device Power Module TIM
  • DC source and measurement for device test
  • Low speed static digital for managing test circuit configuration
  • Pulsed 3 A current source and measure
  • All dynamic features are synchronous
  • Supports multi-site test
  • 8x 250 mA 4 quadrant supplies
  • 4x 3A single quadrant pulsed supplies
  • 16 Low Speed Digital lines
  • 8 Voltage Measure Lines

High Speed Digital Module
  • 20 - 1200 Pins (120 Pins per TIM)
  • 100 MHz Clock and Data
  • Synchronous Mixed Signal Performance
  • Configurable for Data, CPU, Scan, Signal, Serial and Parallel
  • Full Parametrics
Vector Rate
Data Formats (NRZ)100k to 100M vector per second
Clock Formats (ZS)100 MHz max
Vector Depth
Scan (std)
Scan (opt)
Capture
Pattern(std)		128 Mbits ( shared by bank of 20 pins )
1024 Mbits ( shared by bank of 20 pins )
512 kbits
16M vectors per pin
Pin edge timing
OTA
Rise/fall time
Min pulse width
Edge resolution
Edge sets
Edges
Jitter		750 ps
2 ns
5 ns
20 ps
2
32 per bank of 20 pins
200 ps rms

Custom TIM
Please contact RI for information on custom TIMs.
  • Cutting edge technology integrated with ATE capabilities

    • Multiple TIMs can be configured per tester for maximum flexibility.