Cassini Modular ATE for Digital Devices
Cassini Small InfrastructureA Complete High Speed Automated
and Integrated Test Solution for:
  • Testing for Wafer, Package and Module formats
  • Protocol Based Engine for DUT Control
  • 120 Pins per TIM
    (Up to 10 TIMs per tester)
  • Pattern Import Tools
  • Logic Analysis Tools
  • Native JTAG Support
  • Pattern Generation on the Fly

Recommended Tester Instrument Modules (TIMs) for Digital Testing
Multiple TIMs can be configured per tester for maximum flexibility, like upgrading to multi-site testing. One Device Power module per site.

Device Power Module TIM
  • DC source and measurement for device test
  • Low speed static digital for managing test circuit configuration
  • Pulsed 3 A current source and measure
  • All dynamic features are synchronous
  • Supports multi-site test
  • 8x 250 mA 4 quadrant supplies
  • 4x 3A single quadrant pulsed supplies
  • 16 Low Speed Digital lines
  • 8 Voltage Measure Lines

High Speed Digital Module
  • 20 - 1200 Pins (120 Pins per TIM)
  • 100 MHz Clock and Data
  • Synchronous Mixed Signal Performance
  • Configurable for Data, CPU, Scan, Signal, Serial and Parallel
  • Full Parametrics
Vector Rate
Data Formats (NRZ)100k to 100M vector per second
Clock Formats (ZS)100 MHz max
Vector Depth
Scan (std)
Scan (opt)
Capture
Pattern(std)
128 Mbits ( shared by bank of 20 pins )
1024 Mbits ( shared by bank of 20 pins )
512 kbits
16M vectors per pin
Pin edge timing
OTA
Rise/fall time
Min pulse width
Edge resolution
Edge sets
Edges
Jitter
750 ps
2 ns
5 ns
20 ps
2
32 per bank of 20 pins
200 ps rms

Custom TIM
Please contact RI for information on custom TIMs.
  • Cutting edge technology integrated with ATE capabilities

  • Multiple TIMs can be configured per tester for maximum flexibility.


    Applications:
    3G Devices (or Similar)